STM32F411CC datasheet(142/149 Pages) STMICROELECTRONICS

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Recommendations when using the internal reset OFF

STM32F411xC STM32F411xE

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DocID026289 Rev 6

Appendix A

Recommendations when using the internal

reset OFF

When the internal reset is OFF, the following integrated features are no longer supported:

•

The integrated power-on-reset (POR)/power-down reset (PDR) circuitry is disabled.

•

The brownout reset (BRO) circuitry must be disabled. By default BOR is OFF.

•

The embedded programmable voltage detector (PVD) is disabled.

•

VBAT functionality is no more available and VBAT pin should be connected to VDD.

A.1

Operating conditions

Table 87. Limitations depending on the operating power supply range

Operating

power supply

range

ADC

operation

Maximum

Flash memory

access

frequency

with no wait

state

(fFlashmax)

Maximum

Flash memory

access

frequency

with no wait

states(1) (2)

1. Applicable only when the code is executed from Flash memory. When the code is executed from RAM, no

wait state is required.

2. Thanks to the ART accelerator and the 128-bit Flash memory, the number of wait states given here does

not impact the execution speed from Flash memory since the ART accelerator allows to achieve a

performance equivalent to 0 wait state program execution.

I/O operation

Possible

Flash memory

operations

VDD = 1.7 to

2.1 V(3)

3. VDD/VDDA minimum value of 1.7 V, with the use of an external power supply supervisor (refer to

Section 3.15.1: Internal reset ON).

Conversion

time up to

1.2 Msps

20 MHz(4)

4. Prefetch is not available. Refer to AN3430 application note for details on how to adjust performance and

power.

100 MHz with

6 wait states

No I/O

compensation

8-bit erase and

program

operations only

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