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STTH5R06-Y 数据表(PDF) 5 Page - STMicroelectronics |
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STTH5R06-Y 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() STTH5R06-Y Characteristics Doc ID 17655 Rev 1 5/9 Figure 13. Thermal resistance junction to ambient versus copper surface under tab (DPAK) Figure 11. Junction capacitance versus reverse voltage applied (typical values) Figure 12. Thermal resistance junction to ambient versus copper surface under tab (D2PAK) C(pF) 10 100 1 10 100 1000 F=1 MHz VOSC=30 mVRMS Tj=25 °C V (V) R R (°C/W) th(j-a) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 D²PAK S(Cu)(cm²) Epoxy printed circuit board FR4 copper thickness = 35 µm R (°C/W) th(j-a) 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 DPAK S(Cu)(cm²) Epoxy printed circuit board FR4 copper thickness = 35 µm |
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