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STTH8ST06 数据表(PDF) 3 Page - STMicroelectronics |
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STTH8ST06 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 9 page ![]() DocID024150 Rev 2 3/9 STTH8ST06 Characteristics Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit trr Reverse recovery time Tj = 25 °C IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs -20 26 ns IF = 8 A, VR = 400 V, dIF/dt = -200 A/µs -13 17 IRM Reverse recovery current Tj = 125 °C IF = 8 A, VR = 400 V, dIF/dt = -200 A/µs -2 2.6 A S Softness factor - 0.9 - QRR Reverse recovery charge Tj = 25 °C - 4 nC Tj = 125 °C - 20 Figure 1. Average forward power dissipation versus average forward current Figure 2. Forward voltage drop versus forward current (typical values) P F(AV)(W) 0 5 10 15 20 25 30 35 40 01 234 56 789 10 11 T δ=tp/T tp δ=0.05 δ=0.1 =0.2 δ δ =0.5 δ=1 IF(AV)(A) I FM(A) 0.1 1.0 10.0 100.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 T j=150 °C T j=125 °C T j=25 °C VFM(V) Figure 3. Relative variation of thermal impedance, junction to case, versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) Z th(j-c)/Rth(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 Single pulse tp() s |
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