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STF12N50DM2 数据表(PDF) 3 Page - STMicroelectronics |
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STF12N50DM2 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 13 page ![]() STF12N50DM2 Electrical ratings DocID026809 Rev 2 3/13 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID(1) Drain current (continuous) at TC = 25 °C 11 A ID(1) Drain current (continuous) at TC= 100 °C 8 IDM(2) Drain current (pulsed) 44 A PTOT Total dissipation at TC = 25 °C 25 W dv/dt (3) Peak diode recovery voltage slope 40 V/ns dv/dt (4) MOSFET dv/dt ruggedness 50 V/ns VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s, TC = 25 °C) 2500 V Tstg Storage temperature range -55 to 150 °C Tj Operating junction temperature range Notes: (1)Limited by maximum junction temperature. (2)Pulse width limited by safe operating area. (3) ISD ≤ 11 A, di/dt ≤ 400 A/µs; VDS peak < V(BR)DSS, VDD = 80% V(BR)DSS (4) VDS ≤ 400 V Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 5 °C/W Rthj-amb Thermal resistance junction-amb max 62.5 Table 4: Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetetive or not repetetive (pulse width limited by Tjmax) 2.5 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 320 mJ |
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