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STF12N50DM2 数据表(PDF) 4 Page - STMicroelectronics

部件名 STF12N50DM2
功能描述  Fast-recovery body diode
PDF  13 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STF12N50DM2 数据表(HTML) 4 Page - STMicroelectronics

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Electrical characteristics
STF12N50DM2
4/13
DocID026809 Rev 2
2
Electrical characteristics
(TC = 25 °C unless otherwise specified).
Table 5: Static
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V(BR)DSS
Drain-source
breakdown voltage
VGS = 0 V, ID = 1 mA
500
V
IDSS
Zero gate voltage
drain current
VGS = 0 V, VDS = 500 V
1
µA
VGS = 0 V, VDS = 500 V,
TC = 125 °C(1)
100
µA
IGSS
Gate-body leakage
current
VDS = 0 V, VGS = ±25 V
±10
µA
VGS(th)
Gate threshold
voltage
VDS = VGS, ID = 250 µA
3
4
5
V
RDS(on)
Static drain-source
on-resistance
VGS = 10 V, ID = 5.5 A
0.299
0.350
Ω
Notes:
(1)Defined by design, not subject to production test.
Table 6: Dynamic
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Ciss
Input capacitance
VDS= 100 V, f = 1 MHz,
VGS = 0 V
-
628
-
pF
Coss
Output capacitance
-
38
-
pF
Crss
Reverse transfer
capacitance
-
1.2
-
pF
Coss eq.(1)
Equivalent output
capacitance
VDS = 0 V to 400 V, VGS = 0 V
-
69
-
pF
RG
Intrinsic gate
resistance
f = 1 MHz open drain
-
7
-
Ω
Qg
Total gate charge
VDD = 400 V, ID = 11 A,
VGS = 10 V (see Figure 15: "Test
circuit for gate charge behavior")
-
16
-
nC
Qgs
Gate-source charge
-
4.6
-
nC
Qgd
Gate-drain charge
-
7
-
nC
Notes:
(1) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS
increases from 0 to 80% VDSS
Table 7: Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on delay time
VDD = 250 V, ID = 5.5 A
RG = 4.7
Ω, VGS = 10 V (see
Figure 14: "Test circuit for
resistive load switching times"
and Figure 19: "Switching time
waveform")
-
12.5
-
ns
tr
Rise time
-
9
-
ns
td(off)
Turn-off-delay time
-
28
-
ns
tf
Fall time
-
9.8
-
ns



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