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STGP30H60DFB 数据表(PDF) 1 Page - STMicroelectronics |
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STGP30H60DFB 数据表(HTML) 1 Page - STMicroelectronics |
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1 / 21 page ![]() This is information on a product in full production. October 2015 DocID026677 Rev 2 1/21 21 STGB30H60DFB, STGP30H60DFB Trench gate field-stop IGBT, HB series 600 V, 30 A high speed Datasheet - production data Figure 1. Internal schematic diagram Features • Maximum junction temperature: TJ = 175 °C • High speed switching series • Minimized tail current • VCE(sat) = 1.55 V (typ.) @ IC = 30 A • Tight parameters distribution • Safe paralleling • Low thermal resistance • Very fast soft recovery antiparallel diode Applications • Photovoltaic inverters • High frequency converters Description These devices are IGBTs developed using an advanced proprietary trench gate and field stop structure. The device is part of the new HB series of IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of any frequency converter. Furthermore, a slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. C (2, TAB) E (3) G (1) Table 1. Device summary Order code Marking Package Packaging STGB30H60DFB GB30H60DFB D2PAK Tape and reel STGP30H60DFB GP30H60DFB TO-220 Tube www.st.com |
类似零件编号 - STGP30H60DFB |
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类似说明 - STGP30H60DFB |
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