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STTH60AC06C 数据表(PDF) 4 Page - STMicroelectronics |
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STTH60AC06C 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 13 page ![]() Characteristics STTH60AC06C 4/13 DocID024886 Rev3 Figure 5. Relative variation of thermal impedance, junction to case, versus pulse duration (TO-3PF) Figure 6. Peak reverse recovery current versus dIF/dt (typical values, per diode) Zth( j-c) /Rth( j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 t (s) P Single pulse TO- 3PF IRM (A) 0 5 10 15 20 25 0 50 100 150 200 250 300 350 400 450 500 dIF/dt(A/µs) IF = 30 A V R = 400 V T j = 125 °C Figure 7. Reverse recovery time versus dIF/dt (typical values, per diode) Figure 8. Reverse recovery charges versus dIF/dt (typical values, per diode) tRR(ns) 0 50 100 150 200 250 300 350 400 0 50 100 150 200 250 300 350 400 450 500 dIF/dt(A/µs) IF = 30 A V R = 400 V T j = 125 °C QRR(nC) 0 500 1000 1500 2000 2500 0 50 100 150 200 250 300 350 400 450 500 dIF/dt(A/µs) IF = 30 A V R = 400 V T j = 125 °C Figure 9. Reverse recovery softness factor versus dIF/dt (typical values, per diode) Figure 10. Relative variations of dynamic parameters versus junction temperature S FACTOR 0.0 0.5 1.0 1.5 2.0 2.5 0 50 100 150 200 250 300 350 400 450 500 dIF/dt(A/µs) IF = 30 A V R = 400 V T j = 125 °C 0.0 0.5 1.0 1.5 2.0 25 50 75 100 125 I RM S FACTOR Tj(°C) I F = 30 A; VR = 400 V Reference: Tj = 125 °C Q RR |
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