STM32L432KB datasheet(62/149 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32L432KB STM3L432KC

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DocID028798 Rev 2

6.3

Operating conditions

6.3.1

General operating conditions

Table 20. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK Internal AHB clock frequency

MHz

fPCLK1 Internal APB1 clock frequency

fPCLK2 Internal APB2 clock frequency

VDD

Standard operating voltage

1.71

(1)

3.6

VDDA Analog supply voltage

ADC or COMP used

1.62

3.6

DAC or OPAMP used

1.8

ADC, DAC, OPAMP, COMP not

used

VDDUSB USB supply voltage

USB used

3.0

3.6

USB not used

3.6

VIN

I/O input voltage

TT_xx I/O

-0.3

VDDIOx+0.3

All I/O except TT_xx

-0.3

MIN(MIN(VDD, VDDA,

VDDUSB)+3.6 V,

5.5 V)(2)(3)

Power dissipation at

TA = 125 °C for suffix 3(4)

UFQFPN32

128

Power dissipation at

TA = 85 °C for suffix 6

TA = 105 °C for suffix 7(4)

UFQFPN32

523

Ambient temperature for the

suffix 6 version

Maximum power dissipation

–40

°C

Low-power dissipation(5)

–40

105

Ambient temperature for the

suffix 7 version

Maximum power dissipation

–40

105

Low-power dissipation(5)

–40

125

Ambient temperature for the

suffix 3 version

Maximum power dissipation

–40

125

Low-power dissipation(5)

–40

130

Junction temperature range

Suffix 6 version

–40

105

°C

Suffix 7 version

–40

125

Suffix 3 version

–40

130

1. When RESET is released functionality is guaranteed down to VBOR0 Min.

2. This formula has to be applied only on the power supplies related to the IO structure described by the pin definition table.

Maximum I/O input voltage is the smallest value between MIN(VDD, VDDA, VDDUSB)+3.6 V and 5.5V.

3. For operation with voltage higher than Min (VDD, VDDA, VDDUSB) +0.3 V, the internal Pull-up and Pull-Down resistors must

be disabled.

4. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 7.2: Thermal characteristics).

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