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STM32L432KB 数据表(PDF) 143 Page - STMicroelectronics |
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STM32L432KB 数据表(HTML) 143 Page - STMicroelectronics |
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143 / 149 page  DocID028798 Rev 2 143/149 STM32L432KB STM3L432KC Package information 146 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFQFPN32 package information Figure 30. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. |
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