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MDF1922TH 数据表(PDF) 4 Page - MagnaChip Semiconductor. |
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MDF1922TH 数据表(HTML) 4 Page - MagnaChip Semiconductor. |
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4 / 6 page ![]() Jan. 2015. Rev 1.0 MagnaChip Semiconductor Ltd. 4 Fig.7 Gate Charge Characteristics Fig.8 Capacitance Characteristics Fig.9 Maximum Safe Operating Area Fig.10 Maximum Drain Current vs. Case Temperature Fig.11 Transient Thermal Response Curve 25 50 75 100 125 150 0 5 10 15 20 25 30 35 40 45 50 T C, Case Temperature [ ℃] 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 -4 10 -3 10 -2 10 -1 10 0 10 1 ※ Notes : Duty Factor, D=t 1/t2 PEAK T J = PDM * Z θ JC* Rθ JC(t) + TC single pulse D=0.5 0.02 0.2 0.05 0.1 0.01 t 1, Rectangular Pulse Duration [sec] 0 5 10 15 20 25 30 35 40 0 1000 2000 3000 4000 5000 C iss = Cgs + Cgd (Cds = shorted) C oss = Cds + Cgd C rss = Cgd ※ Notes ; 1. V GS = 0 V 2. f = 1 MHz C rss C oss C iss V DS, Drain-Source Voltage [V] 0 10 20 30 40 50 60 0 2 4 6 8 10 V DS = 50V ※ Note : I D = 50A Q G, Total Gate Charge [nC] 10 -1 10 0 10 1 10 2 10 -1 10 0 10 1 10 2 1000 ms 100 ms 1 ms 10 ms DC 100 us Operation in This Area is Limited by R DS(on) Single Pulse T J=Max rated T C=25 ℃ V DS, Drain-Source Voltage [V] |
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