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M34E02-F 数据表(PDF) 33 Page - STMicroelectronics |
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M34E02-F 数据表(HTML) 33 Page - STMicroelectronics |
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33 / 36 page ![]() DocID10367 Rev 14 33/36 M34E02-F Revision history 10 Revision history Table 18. Document revision history Date Revision Changes 13-Nov-2003 1.0 First release 01-Dec-2003 1.1 TSSOP8 4.4x3 package replaces TSSOP8 3x3 (MSOP8) package. Correction to sentence in “Setting the Write Protection”. Correction to specification of tNS values. 29-Mar-2004 1.2 Always NoACK after Address and Data bytes in Table 6. Improvement in VIO and VCC (min) in Absolute Maximum Ratings table. IOL changed for test condition of VOL. MLP package mechanical data respecified. Soldering temperature information clarified for RoHS compliant devices. 14-Apr-2004 2.0 First public release 24-Nov-2004 3.0 Direct connection of E0, E1, E2 to VSS and VCC (see Chip Enable (E0, E1, E2) and Use within a DDR1/DDR2/DDR3 DRAM module paragraphs). ZEiL and ZEiH parameters added to Table 11: Input parameters. E0, E1, E2 removed from the Parameter descriptions of VIL and VIH in Table 13: DC characteristics (for temperature range 6 devices). Document status promoted from Product Preview to full Datasheet. 11-Mar-2005 4.0 Datasheet title changed. Features revised. Plating Technology options updated in Table 17: Ordering information scheme. Resistance and capacitance renamed in Figure 4: Maximum RP value versus bus parasitic capacitance (C) for an I2C bus. 28 -Apr-2005 5.0 Text in Power On Reset changed. Noise filter value in Table 11: Input parameters modified. ICC value 2mA, when Vcc=3/6V, added to Table 13: DC characteristics (for temperature range 6 devices). 10-Apr-2006 6 In Table 14: AC characteristics: Frequency fC changed from 100kHz to 400kHz, related AC timings (tCHCL, tCLCH, tDXCX, tCLQV max, tCHDX, tDLCL, tCHDH, tDHDL) also modified. Power On Reset paragraph removed replaced by Internal device reset. Figure 3: Device select code inserted. ICC1 modified in Table 13: DC characteristics (for temperature range 6 devices). Note 3 added to Figure 14 and Note 2 added to Figure 15 All packages are ECOPACK® (see text added under Description and Part numbering, TLEAD removed from Table 7: Absolute maximum ratings). |
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