Package information

ESDAVLC5-4BX4

4/8

DocID023365 Rev 2

2

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 9. Micro package dimensions

Figure 10. Marking

Note:

The marking codes can be rotated by 90° or 180° to differentiate assembly location. In no

case should this product marking be used to orient the component for its placement on a

PCB. Only pin 1 mark is to be used for this purpose.

800 ±30 µm

200 ±16 µm

706 ±16 µm

Thickness: 350 ±30 µm

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