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SMP75 数据表(PDF) 3 Page - STMicroelectronics |
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SMP75 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 9 page ![]() SMP75 Characteristics Doc ID 5015 Rev 5 3/9 Table 2. Absolute ratings (Tamb = 25 °C) Symbol Parameter Value Unit IPP Repetitive peak pulse current 10/1000 µs 8/20 µs 10/560 µs 5/310 µs 10/160 µs 1/20 µs 2/10 µs 75 250 100 120 150 250 250 A IFS Fail-safe mode : maximum current (1) 8/20 µs 5 kA ITSM Non repetitive surge peak on-state current (sinusoidal) t = 0.2 s t = 1 s t = 2 s t = 15 mn 14 8 6.5 2 A I²t I²t value for using t = 16.6 ms t = 20 ms 12 12.2 A²s Tstg Storage temperature range -55 to + 150 °C Tj Maximum junction temperature 150 °C TL Maximum lead temperature for soldering during 10 s. 260 °C 1. In fail safe mode, the device acts as a short circuit. Table 3. Thermal resistances Symbol Parameter Value Unit Rth(j-a) Junction to ambient (with recommended footprint) 100 °C/W Rth(j-l) Junction to leads 20 °C/W Table 4. Electrical characteristics - definitions (Tamb = 25 °C) Symbol Parameter VRM Stand-off voltage VBR Breakdown voltage VBO Breakover voltage IRM Leakage current IPP Peak pulse current IBO Breakover current IH Holding current VR Continuous reverse voltage IR Leakage current at VR C Capacitance |
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