SMP75 datasheet(5/9 Pages) STMICROELECTRONICS

5 / 9 page

SMP75

Characteristics

Doc ID 5015 Rev 5

5/9

Figure 6.

Relative variation of breakover

voltage versus junction

temperature

Figure 7.

Relative variation of leakage

current versus reverse voltage

applied (typical values)

[Tj] / V

[Tj=25°C]

0.94

0.95

0.96

0.97

0.98

0.99

1.00

1.01

1.02

1.03

1.04

1.05

1.06

1.07

1.08

-40 -30 -20 -10

90 100 110 120 130

Tj(°C)

100

1000

10000

100

125

I [Tj] / I [Tj=25°C]

Tj(°C)

Figure 8.

Variation of thermal impedance

junction to ambient versus pulse

duration

Figure 9.

Relative variation of junction

capacitance versus reverse voltage

applied (typical values)

Z/R

th(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

tp(s)

Printed circuit board FR4,

copper thickness = 35 µm,

recommended pad layout

C [V ] / C [V =2V]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

V (V)

F =1MHz

= 1V

Tj = 25°C

OSC

RMS

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