Table of Contents

1. Block diagram

.....................................................................................................................................................3

2. Pin-out

................................................................................................................................................................4

2.1. Pin assignment....................................................................................................................................................................................4

2.2. Pin table...............................................................................................................................................................................................4

2.3. Power domain separation and ESD protection...................................................................................................................................5

3. Electrical, optical and timing characteristics

............................................................................................................6

3.1. Recommended operating conditions...................................................................................................................................................6

3.2. System characteristics.........................................................................................................................................................................6

3.3. Electrical characteristics......................................................................................................................................................................6

3.4. Temperature sensor characteristics....................................................................................................................................................7

3.5. Timing parameters...............................................................................................................................................................................8

3.6. Absolute maximum ratings..................................................................................................................................................................8

3.7. Optical characteristics..........................................................................................................................................................................9

3.7.1. Typical spectral range and quantum efficiency (QE).....................................................................................................................10

3.8. Frequency response..........................................................................................................................................................................10

4. Chip configuration

.............................................................................................................................................11

4.1. Configuration pin description.............................................................................................................................................................11

4.2. Dynamic change of the configuration pins........................................................................................................................................12

4.3. Charge pump on/off through DATA_RDY strap pin..........................................................................................................................12

4.4. Frequency response setting..............................................................................................................................................................12

5. Imager operation

................................................................................................................................................13

5.1. General remarks................................................................................................................................................................................13

5.2. Image acquisition...............................................................................................................................................................................13

5.3. Multi frame acquisition.......................................................................................................................................................................14

5.4. Image readout....................................................................................................................................................................................14

5.5. Readout configuration........................................................................................................................................................................15

5.6. Periodic flushing................................................................................................................................................................................15

5.7. Clearing the CCD pixel field and the CCD frame store with CLR_DATA..........................................................................................15

6. Temperature sensor

...........................................................................................................................................16

7. Power-down mode

.............................................................................................................................................16

8. Chip reset

.........................................................................................................................................................16

9. Measuring the internal oscillator clock frequency

...................................................................................................16

10. I2C interface

....................................................................................................................................................17

10.1. I2C communication..........................................................................................................................................................................17

10.1.1. Device addressing........................................................................................................................................................................17

10.1.2. Single-byte write...........................................................................................................................................................................17

10.1.3. Multi-byte write..............................................................................................................................................................................17

10.1.4. Single-byte read............................................................................................................................................................................18

10.1.5. Multi-byte read..............................................................................................................................................................................18

10.1.6. Software reset...............................................................................................................................................................................18

10.1.7. Re-sampling the device address..................................................................................................................................................18

10.2. Setup latency...................................................................................................................................................................................18

10.3. I2C register description....................................................................................................................................................................19

10.4. I2C bus timing..................................................................................................................................................................................26

11. Application information

.....................................................................................................................................27

11.1. Circuit for differential mode..............................................................................................................................................................27

11.2. Circuit for single ended mode..........................................................................................................................................................28

11.3. External components.......................................................................................................................................................................28

11.4. Low noise operation.........................................................................................................................................................................28

11.4.1. Charge pump noise......................................................................................................................................................................28

11.4.2. Video amplifier noise....................................................................................................................................................................28

12. Power consumption considerations

....................................................................................................................29

12.1. General considerations....................................................................................................................................................................29

12.2. Low power operation with external 3V and 5V supply....................................................................................................................29

13. Layout and packaging information

......................................................................................................................30

13.1. Mechanical dimensions...................................................................................................................................................................30

13.2. Location of the photosensitive area.................................................................................................................................................30

13.3. Layout recommendations................................................................................................................................................................31

13.3.1. Electrical.......................................................................................................................................................................................31

13.3.2. PCB design and SMD manufacturing process considerations....................................................................................................32

14. Tape & Reel Information

....................................................................................................................................33

14.1. Soldering and IC handling...............................................................................................................................................................33

15. Self-test mode by fill-and-spill

............................................................................................................................34

15.1. Important notes to fill-and-spill.........................................................................................................................................................35

16. Ordering Information

........................................................................................................................................36

17. Note to various chip releases

.............................................................................................................................36

17.1. epc901-007 up to -016, -018, -020, -021, -022, -023......................................................................................................................36

17.2. epc901-007 up to -016, -018, -020, -021, -022...............................................................................................................................36

17.3. epc901-016......................................................................................................................................................................................36

17.4. epc901-007 up to and including -018, -020, -022...........................................................................................................................36

17.5. epc901-031......................................................................................................................................................................................36

© 2016 ESPROS Photonics Corporation

Characteristics subject to change without notice

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Datasheet_epc901-V5.6

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