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LPC2124 数据表(PDF) 25 Page - NXP Semiconductors

部件名 LPC2124
功能描述  Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP Flash with 10-bit ADC
PDF  34 Pages
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制造商  PHILIPS [NXP Semiconductors]
网页  http://www.nxp.com
标志 PHILIPS - NXP Semiconductors

LPC2124 数据表(HTML) 25 Page - NXP Semiconductors

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Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
Product data
Rev. 03 — 22 December 2004
25 of 34
9397 750 13145
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
7.
Limiting values
[1]
The following applies to the Limiting values:
a) Stresses above those listed under Limiting values may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any conditions other than those described in Section 8 “Static characteristics” and
Section 9 “Dynamic characteristics” of this specification is not implied.
b) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
c) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Only valid when the V3 supply voltage is present.
[4]
Not to exceed 4.6 V.
[5]
The peak current is limited to 25 times the corresponding maximum current.
[6]
Dependent on package type.
Table 9:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
V18
Supply voltage, internal rail
−0.5
+2.5
V
V3
Supply voltage, external rail
−0.5
+3.6
V
V3A
Analog 3.3 V pad supply voltage
−0.5
4.6
V
AVIN
Analog input voltage on A/D related pins
−0.5
5.1
V
Vi
DC input voltage, 5 V tolerant I/O pins
[2][3]
−0.5
6.0
V
Vi
DC input voltage, other I/O pins
[4][2]
−0.5
V3 + 0.5
V
I
DC supply current per supply pin
[5]
-
100
mA
I
DC ground current per ground pin
[5]
-
100
mA
Tstg
Storage temperature
[6]
−65
150
°C
P
Power dissipation (based on package heat
transfer, not device power consumption)
1.5
-
W



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