ADA4841-1/ADA4841-2

Data Sheet

Rev. G | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

12.6 V

Power Dissipation

See Figure 5

Common-Mode Input Voltage

Differential Input Voltage

1.8 V

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature

JEDEC J-STD-20

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

specified for device soldered in circuit board for surface-mount

packages.

Table 5. Thermal Resistance

Package Type

Unit

8-lead SOIC_N

125

°C/W

6-Lead SOT-23

170

°C/W

8-lead MSOP

130

°C/W

8-Lead LFCSP_WD

103

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4841-1/

ADA4841-2 is limited by the associated rise in junction

the glass transition temperature, the plastic changes its

properties. Even temporarily exceeding this temperature limit

may change the stresses that the package exerts on the die,

permanently shifting the parametric performance of the

amplifiers. Exceeding a junction temperature of 150°C for an

extended period can result in changes in silicon devices,

potentially causing degradation or loss of functionality.

quiescent power dissipation and the power dissipated in the die

due to the amplifier’s drive at the output. The quiescent power is



L

OUT

L

OUT

S

S

S

D

R

V

R

V

V

I

V

P

2

2























 



L

S

S

S

D

R

V

I

V

P

2

4

/







In addition, more metal directly in contact with the package

Figure 5 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 8-lead SOIC_N

(125°C/W), the 6-lead SOT-23 (170°C/W), 8-lead MSOP

(145°C/W), and 8-lead LFCSP_WD (103°C/W) on a JEDEC

2.0

0

–55

125

AMBIENT TEMPERATURE (°C)

1.5

1.0

0.5

–45 –35 –25 –15 –5

5

15 25 35 45 55 65 75 85 95 105 115

SOT-23

SOIC

MSOP

LFCSP

Figure 5. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION