ADA4841-1/ADA4841-2

Data Sheet

Rev. G | Page 20 of 20

2.44

2.34

2.24

0.30

0.25

0.20

PIN 1 INDEX

AREA

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

3.10

3.00 SQ

2.90

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-W3030D-4

0.20 MIN

8

1

5

4

SEATING

PLANE

TOP VIEW

SIDE VIEW

EXPOSED

PAD

BOTTOM VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

1

DETAIL A

(JEDEC 95)

Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-11)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Ordering Quantity

Branding

ADA4841-1YRZ

−40°C to +125°C

8-Lead SOIC_N

R-8

1

ADA4841-1YRZ-R7

−40°C to +125°C

8-Lead SOIC_N

R-8

1,000

ADA4841-1YRZ-RL

−40°C to +125°C

8-Lead SOIC_N

R-8

2,500

ADA4841-1YRJZ-R2

−40°C to +125°C

6-Lead SOT-23

RJ-6

250

HQB

ADA4841-1YRJZ-R7

−40°C to +125°C

6-Lead SOT-23

RJ-6

3,000

HQB

ADA4841-2YRMZ

−40°C to +125°C

8-Lead MSOP

RM-8

1

HRB

ADA4841-2YRMZ-R7

−40°C to +125°C

8-Lead MSOP

RM-8

1,000

HRB

ADA4841-2YRMZ-RL

−40°C to +125°C

8-Lead MSOP

RM-8

3,000

HRB

ADA4841-2YRZ

−40°C to +125°C

8-Lead SOIC_N

R-8

1

ADA4841-2YRZ-R7

−40°C to +125°C

8-Lead SOIC_N

R-8

1,000

ADA4841-2YRZ-RL

−40°C to +125°C

8-Lead SOIC_N

R-8

2,500

ADA4841-2YCPZ-R2

−40°C to +125°C

8-Lead LFCSP

CP-8-11

250

HRB

ADA4841-2YCPZ-R7

−40°C to +125°C

8-Lead LFCSP

CP-8-11

1,500

HRB

ADA4841-2YCPZ-RL

−40°C to +125°C

8-Lead LFCSP

CP-8-11

5,000

HRB

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registered trademarks are the property of their respective owners.

D05614–0–3/17(G)