 2003 Microchip Technology Inc.

DS21749D-page 13

93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

D

A

A1

L

c

(F)

α

A2

E1

E

p

B

n

1

2

φ

β

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037 REF

F

Footprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

β

α

c

B

φ

.003

.009

.006

.012

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

A

L

E1

D

A1

E

A2

.016

.024

.118 BSC

.118 BSC

.000

.030

.193 TYP.

.033

MIN

p

n

Units

.026 BSC

NOM

8

INCHES

0.95 REF

-

-

.009

.016

0.08

0.22

0°

0.23

0.40

8°

MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX

NOM

1.10

0.80

0.15

0.95

MAX

8

--

-

15°

5°

-

15°

5°

-

JEDEC Equivalent: MO-187

0°

-

8°

5°

5°

-

-

15°

15°

-

-

-

-