ADP1610ARMZ-R7 datasheet(15/16 Pages) AD

15 / 16 page

ADP1610

Rev. 0 | Page 15 of 16

LAYOUT PROCEDURE

To get high efficiency, good regulation, and stability, a well-

designed printed circuit board layout is required. Where

possible, use the sample application board layout as a model.

Follow these guidelines when designing printed circuit boards

(see Figure 1):

•

Keep the low ESR input capacitor, CIN, close to IN and

GND.

•

Keep the high current path from CIN through the inductor

L1 to SW and PGND as short as possible.

•

Keep the high current path from CIN through L1, the

rectifier D1, and the output capacitor COUT as short as

possible.

•

Keep high current traces as short and as wide as possible.

•

Place the feedback resistors as close to the FB pin as

possible to prevent noise pickup.

•

Place the compensation components as close as possible to

COMP.

•

Avoid routing high impedance traces near any node

connected to SW or near the inductor to prevent radiated

noise injection.

Figure 31. Sample Application Board (Bottom Layer)

Figure 32. Sample Application Board (Top Layer)

Figure 33. Sample Application Board (Silkscreen Layer)

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