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LT1681 数据表(PDF) 14 Page - Linear Technology |
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LT1681 数据表(HTML) 14 Page - Linear Technology |
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14 / 20 page ![]() 14 LT1681 1681f Layout Considerations—Grounding The LT1681 is typically used in high current converter designs that involve substantial switching transients. The switch drivers on the IC are designed to drive large capacitances and, as such, generate significant transient currents. Careful consideration must be made regarding input and local power-supply bypassing to avoid corrupt- ing the ground references used by the error amplifier and current sense circuitry. Effective grounding of the two-transistor synchronous forward topology where the LT1681 is used is inherently difficult. The situation is complicated further by the num- ber of bypass elements that must be considered. Typically, high current paths and transients from the input supply and any local drive supplies must be kept isolated from SGND, to which sensitive circuits such as the error amp reference and the current sense circuits, as well as the local 5VREF supply, are referred. By virtue of the topologies used in LT1681 applications, the large currents from the primary switches, as well as the switch drive transients, LT1681 5VREF SGND VBST VBST VIN BSTREF VCC VCC PGND 1681 F06 pass through the sense resistor to ground. This defines the ground connection of the sense resistor as the refer- ence point for both SGND and PGND. In nonisolated applications where SGND is the output reference, we now have a condition where every bypass capacitor in the converter is referenced to the same point. Effective grounding can be achieved by considering the return current paths from the sense resistor to each respective bypass capacitor. Don’t be tempted to run small traces to separate the grounds. A power ground plane is important as always in high-power converters, but bypass elements must be oriented such that transient currents in the return paths of VIN and VCC do not mix. Care must be taken to keep these transients away from the SGND reference. An effective approach is to use a 2-layer ground plane, reserving an entire layer for SGND. The 5VREF and non-isolated converter output bypasses can then be directly connected to the SGND plane. Figure 6. High Current Transient Return Paths APPLICATIO S I FOR ATIO |
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