1 Features
Processor Cores:
• Up to Quad 64-bit Arm® Cortex®-A53
microprocessor subsystem at up to 1.4GHz
– Quad-core Cortex-A53 cluster with 512KB L2
shared cache with SECDED ECC
– Each A53 core has 32KB L1 DCache with
SECDED ECC and 32KB L1 ICache with Parity
protection
• Single-core Arm® Cortex®-R5F at up to 800MHz,
integrated as part of MCU Channel with FFI
– 32KB ICache, 32KB L1 DCache, and 64KB
TCM with SECDED ECC on all memories
– 512KB SRAM with SECDED ECC
• Single-core Arm® Cortex®-R5F at up to 800MHz,
integrated to support Device Management
– 32KB ICache, 32KB L1 DCache, and 64KB
TCM with SECDED ECC on all memories
• Single-core Arm® Cortex®-R5F at up to 800MHz,
integrated to support Run-time Management
– 32KB ICache, 32KB L1 DCache, and 64KB
TCM with SECDED ECC on all memories
• Two Deep Learning Accelerators (up to 4 TOPS
total), each with:
– C7x floating point, up to 40 GFLOPS, 256-bit
Vector DSP at up to 1.0GHz
– Matrix Multiply Accelerator (MMA), up to 2
TOPS (8b) at up to 1.0GHz
– 32KB L1 DCache with SECDED ECC and
64KB L1 ICache with Parity protection
– 2.25MB of L2 SRAM with SECDED ECC
• Depth and Motion Processing Accelerators
(DMPAC)
– Dense Optical Flow (DOF) Accelerator
– Stereo Disparity Engine (SDE) Accelerator
• Vision Processing Accelerators (VPAC) with Image
Signal Processor (ISP) and multiple vision assist
accelerators:
– 600 MP/s ISP
– Support for 12-bit RGB-IR
– Support for up to 16-bit input RAW format
– Line support up to 4096
– Wide Dynamic Range (WDR), Lens Distortion
Correction (LDC), Vision Imaging Subsystem
(VISS), and Multi-Scalar (MSC) support
• Output color format : 8-bits, 12-bits, and
YUV 4:2:2, YUV 4:2:0, RGB, HSV/HSL
Multimedia:
• Display subsystem
– Triple display support over OLDI/LVDS (1x
OLDI-DL, 1x or 2x OLDI-SL), DSI or DPI
• OLDI-SL (Single Link): up to 1920 x 1080 at
60fps (165-MHz Pixel Clock)
• OLDI-DL (Dual Link): up to 3840 x 1080 at
60fps (150-MHz Pixel Clock)
• MIPI® DSI: with 4 Lane MIPI® D-PHY
supports up to 3840 x 1080 at 60fps (300-
MHz Pixel Clock)
• DPI (24-bit RGB parallel interface): up to
1920 x 1080 at 60fps (165-MHz pixel clock)
– Four display pipelines with hardware overlay
support. A maximum of two display pipelines
may be used per display.
– Supports safety features such as freeze frame
detection and data correctness check
• 3D Graphics Processing Unit (TDA4VEN)
– IMG BXS-4-64 with 256KB cache
– Up to 50 GFLOPS
– Single shader core
– OpenGL ES3.2 and Vulkan 1.2 API support
• Four Camera Serial Interface (CSI-2) Receiver
with 4 Lane D-PHY
– MIPI® CSI-2 v1.3 Compliant + MIPI® D-PHY
1.2
– CSI-RX supports for 1,2,3, or 4 data lane mode
up to 2.5Gbps per lane
– CSI-TX supports for 1,2, or 4 data lane mode
up to 2.5Gbps per lane
• One CSI2.0 Transmitter with 4 Lane D-PHY
(shared with MIPI DSI)
• Video Encoder/Decoder
– Support for HEVC (H.265) Main profiles at
Level 5.1 High-tier
– Support for H.264 BaseLine/Main/High Profiles
at Level 5.2
– Support for up to 4K UHD resolution
(3840 × 2160)
• Up to 400MPixels/s operation
• Motion JPEG encode at 416MPixels/s with
resolutions up to 4K UHD (3840 × 2160)
Memory Subsystem:
• On-chip RAM dedicated to key processing cores
– 256KB of On-Chip RAM (OCRAM) with
SECDED ECC
– 256KB of On-Chip RAM with SECDED ECC in
SMS Subsystem
– 512KB of On-chip RAM with SECDED ECC in
Cortex-R5F MCU Subsystem
– 64KB of On-chip RAM with SECDED ECC in
R5F Device Manager Subsystem
– 64KB of On-chip RAM with SECDED ECC in
R5F Run-time Manager Subsystem
– 2.25MB of L2 SRAM with SECDED ECC in
each C7x Deep Learning Accelerator (up to
4.5MB total)
• DDR Subsystem (DDRSS)
– Supports LPDDR4 memory types
– 32-bit data bus with inline ECC
– Supports speeds up to 4000 MT/s
– Max LPDDR4 size of 8GB
Functional Safety:
• Functional Safety-Compliant targeted for
Automotive (on select part numbers)
– Developed for functional safety applications
– Documentation will be available to aid ISO
26262 functional safety system design
– Systematic capability up to ASIL D targeted
– Hardware integrity up to ASIL B targeted
– Safety-related certification
• ISO 26262 planned
• AEC - Q100 qualified
Security:
• Secure boot supported
– Hardware-enforced Root-of-Trust (RoT)
– Support to switch RoT via backup key
– Support for takeover protection, IP protection,
and anti-roll back protection
• Trusted Execution Environment (TEE) supported
– Arm TrustZone® based TEE
– Extensive firewall support for isolation
– Secure watchdog/timer/IPC
– Secure storage support
– Replay Protected Memory Block (RPMB)
support
• Dedicated Security Controller with user
programmable HSM core and dedicated security
DMA & IPC subsystem for isolated processing
• Cryptographic acceleration supported
– Session-aware cryptographic engine with ability
to auto-switch key-material based on incoming
data stream
• Supports cryptographic cores
– AES – 128-/192-/256-Bit key sizes
– SHA2 – 224-/256-/384-/512-Bit key sizes
– DRBG with true random number generator
– PKA (Public Key Accelerator) to Assist in
RSA/ECC processing for secure boot
• Debugging security
– Secure software controlled debug access
– Security aware debugging
High-Speed Interfaces:
• PCI-Express® Gen3 single lane controller (PCIE)
– Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3
(8.0GT/s) operation with auto-negotiation
• Integrated Ethernet switch supporting (total 2
external ports)
– RMII(10/100) or RGMII (10/100/1000) or SGMII
(1Gbps)
– IEEE1588 (Annex D, Annex E, Annex F with
802.1AS PTP)
– Clause 45 MDIO PHY management
– Packet Classifier based on ALE engine with
512 classifiers
– Priority based flow control
– Time Sensitive Networking (TSN) support
– Four CPU H/W interrupt Pacing
– IP/UDP/TCP checksum offload in hardware
• USB3.1-Gen1 Port
– One enhanced SuperSpeed Gen1 port
– Port configurable as USB host, USB peripheral,
or USB Dual-Role Device
– Integrated USB VBUS detection
• USB2.0 Port
– Port configurable as USB host, USB peripheral,
or USB Dual-Role Device (DRD mode)
– Integrated USB VBUS detection
General Connectivity and Automotive interfaces:
• 9x Universal Asynchronous Receiver-Transmitters
(UART)
• 5x Serial Peripheral Interface (SPI) controllers
• 7x Inter-Integrated Circuit (I2C) ports
• 5x Multichannel Audio Serial Ports (McASP)
• General-Purpose I/O (GPIO), All LVCMOS I/O can
be configured as GPIO
• 4x Controller Area Network (CAN) modules with
CAN-FD support
Media and Data Storage:
• 3x Secure Digital® (SD®) (4b+4b+8b) interfaces
– 1x 8-bit eMMC interface up to HS400 speed
– 2x 4-bit SD/SDIO interfaces up to UHS-I
– Compliant with eMMC 5.1, SD 3.0, and SDIO
Version 3.0
• 1× General-Purpose Memory Controller (GPMC)
up to 133MHz
• OSPI/QSPI with DDR / SDR support
– Support for Serial NAND and Serial NOR Flash
– 4GBytes memory address support
– XIP mode with optional on-the-fly encryption
Technology / Package:
• 16-nm FinFET technology
• 18 mm x 18 mm, 0.65-mm pitch with VCA, 594-pin
FCBGA (AMW)
Companion Power Management Solution:
• Functional Safety-Compliant support up to ASIL-B
or SIL-2 targeted
• TPS6522x PMIC
• TPS6287x Stackable, Fast Transient Bucks

2 Applications
• Front camera systems
• Surround View and park assistance systems
• eMirror/Camera Mirror System (CMS)
• Radar and Lidar based automotive perception
systems

3 Description
The TDA4VEN/TDA4AEN (aka, TDA4-Entry) processor family is an extension of the Jacinto™ 7 automotivegrade
family of heterogeneous Arm® processors targeted at Advanced Driver Assistance System (ADAS)
applications. With embedded Deep Learning (DL), Video, Vision Processing, and 3D Graphics acceleration,
display interface and extensive automotive peripheral and networking options, TDA4VEN/TDA4AEN is built
for a set of cost and power sensitive automotive applications such as NCAP front camera or entry-level park
assistance systems. The cost optimized TDA4VEN/TDA4AEN provides an optimized performance compute for
both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of
system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple
sensor modalities in stand-alone Electronic Control Units (ECUs).
TDA4VEN/TDA4AEN contains up to four Arm® Cortex®-A53 cores with 64-bit architecture, a Vision Processing
Accelerator (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators, Deep Learning
(DL), Dense Optical Flow (DOF) video and 3D Graphics accelerators, a Cortex®-R5F MCU Island core and two
Cortex®-R5F cores for Device and Run-time Management. The Cortex-A53s provide the powerful computing
elements necessary for Linux applications as well as the implementation of traditional vision computing based
algorithms. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a
broader sensor suite including RGB-InfraRed (RGB-IR), support for higher bit depth, and features targeting
analytics applications. Key cores include TI’s Dense Optical Flow (DOF) accelerator as well two “C7x” next
generation DSP with scalar and vector cores, dedicated “MMA” deep learning accelerator combined with a large
2.25MB L2 memory enabling performance up to 4 TOPS within the lowest power envelope in the industry when
operating at the typical automotive worst case junction temperature of 125°C.
TDA4VEN/TDA4AEN integrates high-speed IOs including a PCIe Gen-3 (1L) and 3-port Gigabit Ethernet switch
with one internal port and two external ports with TSN support. In addition, an extensive peripherals set is
included in TDA4VEN/TDA4AEN to enable system level connectivity such as USB, MMC/SD, four CSI2.0
Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. TDA4VEN/
TDA4AEN supports secure boot for IP protection with the built-in HSM (Hardware Security Module) and
employs advanced power management support for power-sensitive applications. Integrated diagnostics and
safety features support operations up to ASIL-B at SoC level, (ASIL-D systematic level).