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MCP1663 数据表(PDF) 29 Page - Microchip Technology |
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MCP1663 数据表(HTML) 29 Page - Microchip Technology |
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29 / 32 page ![]() 2015 Microchip Technology Inc. DS50002364A-page 29 MCP1663 9V/12V/24V OUTPUT BOOST REGULATOR EVALUATION BOARD USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: BILL OF MATERIALS (BOM) Qty. Reference Description Manufacturer Part Number 1 C1 Cap. ceramic 1 µF 35V 10% X7R SMD 0805 TDK Corporation CGA4J3X7R1V105K125AB 1 C2 Cap. ceramic 1 µF 10V 20% X7R SMD 0603 TDK Corporation C1608X7R1A105M 2 C3, C7 Cap. ceramic 10 µF 16V 20% X5R SMD 0805 TDK Corporation C2012X5R1C106M/0.85 4 C4, C5, C6, C8 Cap. ceramic 10 µF 50V 20% X7S SMD 1210 TDK Corporation C3225X7S1H106M 1 C9 Cap. ceramic 0.1 µF 50V 20% X7R SMD 0603 TDK Corporation C1608X7R1H104M 2 D1, D2 Diode rectifier 1N4148 855 mV 150 mA 75V SOD-323 Diodes® Incorporated 1N4148WS-7 1 D3 Diode Zener 1SMA5918BT3G 5.1V 1.5W DO-214AC_SMA ON Semiconductor® 1SMA5918BT3G 2 D4, D5 Diode Schottky MBRA140T3G 550 mV 1A 40V DO-214AC_SMA ON Semiconductor MBRA140T3G 1 J1 Conn. header-2.54 Male 1x3 tin 5.84 MH th. vert. Samtec, Inc. TSW-103-07-T-S 8 J3, J5, J6, J7, J11, J12, J13, J14 Conn. TP loop tin SMD Harwin Plc S1751-46R 1 JP1 Mech. hardware jumper 2.54 mm 1x2 handle gold TE Connectivity 881545-2 1 L1 Inductor 4.7 µH 2A 20% SMD XFL4020 Coilcraft XFL4020-472MEB 1 L2 Inductor 10 µH 2.2A 20% SMD L4.3W4.3H4.1 Coilcraft XAL4040-103MEB 4PAD1, PAD2, PAD3, PAD4 Mech. hardware rubber pad Bumpon Hemisphere 0.630" x 0.312" black 3M SJ-5027 (BLACK) 2 R1, R2 Resistor 5.6K Ohm 1/4W 1% 1206 SMD Panasonic® Electronic Components Group ERJ-8ENF5601V 1 RB Resistor TKF 9.1k 1% 1/8W SMD 0805 Panasonic Electronic Components Group ERJ-6ENF9101V 1 RB1 Resistor TKF 174k 1% 1/8W SMD 0805 Panasonic Electronic Components Group ERJ-6ENF1743V 1 RB2 Resistor TKF 453k 1% 1/8W SMD 0805 Panasonic Electronic Components Group ERJ-6ENF4533V 1 RT Resistor TKF 169k 1% 1/8W SMD 0805 Panasonic Electronic Components Group ERJ-6ENF1693V Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. |
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