SPWF04SA, SPWF04SC

Module reflow

DocID029757 Rev 5

19/27

9

Module reflow

The SPWF04SA and SPWF04SC are surface mount modules with a 6-layer PCB. The

recommended final assembly reflow profiles are indicated below.

The soldering phase must be executed with care: in order to prevent an undesired melting

phenomenon, particular attention must be paid to the setup of the peak temperature.

The following are some suggestions for the temperature profile based on the IPC/JEDEC J-

STD-020C, July 2004 recommendations.

Table 8: Soldering values

Profile feature

PB-free assembly

3 °C/sec max

Preheat:

150 °C

200 °C

60 - 100 sec

Critical zone:

217 °C

60 - 70 sec

240 + 0 °C

Time within 5 °C of actual peak temperature

10 - 20 sec

Ramp-down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minutes max.

Figure 9: Soldering profile