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TUSB1002AI 数据表(PDF) 25 Page - Texas Instruments

部件名 TUSB1002AI
功能描述  USB3.2 10 Gbps Dual-Channel Linear Redriver
PDF  31 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TUSB1002AI 数据表(HTML) 25 Page - Texas Instruments

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TUSB1002A
www.ti.com
SLLSF63 – MARCH 2018
Product Folder Links: TUSB1002A
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
8.3.3 Application Curves
Figure 23. PCIe Gen1 TX Eye Diagram
Figure 24. PCIe Gen 3 TX Eye Diagram
9 Power Supply Recommendations
The TUSB1002A has two VCC supply pins. It is recommended to place a 100 nF de-coupling capacitor near each
of the VCC pins. It is also recommended to have at least one bulk capacitor of at least 10 µF on the VCC plane
near the TUSB1002A.
10 Layout
10.1 Layout Guidelines
RXP/N and TXP/N pairs should be routed with controlled 90-Ω differential impedance (±15%).
Keep away from other high speed signals.
In USB3 applications maintaining polarity thru the TUSB1002A is not necessary. Therefore it is recommended
to connect polarity in such a way that produces the best routing.
Intra-pair routing should be kept to within 2 mils.
Intra-pair length matching should be near the location of mismatch.
Inter-pair length matching is not necessary.
Each pair should be separated at least by 3 times the signal trace width.
The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left
and right bends should be as equal as possible and the angle of the bend should be
≥ 135 degrees. This
minimizes any length mismatch causes by the bends; ad therefore, minimize the impact bends have on EMI.
Route all differential pairs on the same of layer.
The number of VIAS should be kept to a minimum. It is recommended to keep the VIAS count to 2 or less.
Keep traces on layers adjacent to ground plane.
Do NOT route differential pairs over any plane split.
When using thru-hole USB connectors, it is recommend to route differential pairs on bottom layer in order to
minimize the stub created by the thru-hole connector.
Adding Test points causes impedance discontinuity; and therefore, negatively impact signal performance. If
test points are used, they should be placed in series and symmetrically. They must not be placed in a manner
that causes a stub on the differential pair.



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