AD8392ACP-R2 datasheet(5/16 Pages) AD

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AD8392

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

±13 V (+26 V)

Power Dissipation

See Figure 3

Storage Temperature

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature Range (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, i.e., θJA is specified

for device soldered in circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

Unit

LFCSP-32 (CP)

27.27

°C/W

TSSOP-28/EP (RE)

35.33

°C/W

Maximum Power Dissipation

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS). Assuming that the load (RL) is midsupply,

the total drive power is VS/2 × IOUT, some of which is

dissipated in the package and some in the load (VOUT × IOUT).

RMS output voltages should be considered. If RL is referenced

to VS− as in single-supply operation, the total power is VS × IOUT.

In single supply with RL to VS−, worst case is VOUT = VS/2.

Airflow increases heat dissipation, effectively reducing θJA. Also,

more metal directly in contact with the package leads from

metal traces, through holes, ground, and power planes reduces

the θJA.

Figure 3 shows the maximum safe power dissipation in the

package versus the ambient temperature for the LFCSP-32 and

TSSOP-28/EP packages on a JEDEC standard 4-layer board. θJA

values are approximations.

–40 –30 –20 –10

1020

3040

5060

7080

TEMPERATURE (

°C)

TJ = 150°C

LFCSP-32

TSSOP-28/EP

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

See the Thermal Considerations section for additional thermal

design guidance.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.

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