AD8330

Data Sheet

Rev. H | Page 6 of 32

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

NOTES

1. THE EXPOSED PAD IS NOT CONNECTED INTERNALLY.

FOR INCREASED RELIABILITY OF THE SOLDER JOINTS

AND MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED

THAT THE PAD BE SOLDERED TO THE GROUND PLANE.

VPSI

INHI

INLO

MODE

OPHI

VPSO

OPLO

CMOP

12

11

10

1

3

4

9

2

AD8330

TOP VIEW

(Not to Scale)

Figure 2. 16-Lead LFCSP Pin Configuration

Table 3. 16-Lead LFCSP Pin Function Descriptions

Pin No.

Mnemonic

Description

1

VPSI

Positive Supply for Input Stages.

2

INHI

Differential Signal Input, Positive Polarity.

3

INLO

Differential Signal Input, Negative Polarity.

4

MODE

5

VDBS

6

CMGN

Common Baseline for Gain Control Interfaces.

7

COMM

Ground for Input and Gain Control Bias Circuitry.

8

VMAG

9

CMOP

Ground for Output Stages.

10

OPLO

Differential Signal Output, Negative Polarity.

11

OPHI

Differential Signal Output, Positive Polarity.

12

VPSO

Positive Supply for Output Stages.

13

CNTR

Common-Mode Output Voltage Control.

14

VPOS

Positive Supply for Inner Stages.

15

OFST

Internal Offset Compensation Feature. When the OFST pin is unconnected, this feature is enabled. When the

OFST pin is grounded, this feature is disabled. See the Offset Compensation section.

16

ENBL

Power Enable, Active High.

EPAD

Exposed Pad. The exposed pad is not connected internally. For increased reliability of the solder joints and

maximum thermal capability, it is recommended that the pad be soldered to the ground plane.