AD8141/AD8142

Data Sheet

Rev. B | Page 24 of 24

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8.

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

24

7

12

13

18

19

6

0.30

0.25

0.18

0.25 MIN

2.85

2.70 SQ

2.45

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 50. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-8)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Package

Package Description

Package Option

AD8141ACPZ-R2

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-8

AD8141ACPZ-RL

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-8

AD8141ACPZ-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-8

AD8142ACPZ-R2

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-8

AD8142ACPZ-RL

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-8

AD8142ACPZ-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-8

1

Z = RoHS Compliant Part.

©2011–2017 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D09461-0-3/17(B)