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32F030F4P6 数据表(PDF) 88 Page - STMicroelectronics

部件名 32F030F4P6
功能描述  Value-line Arm®-based 32-bit MCU with up to 256 KB Flash, timers, ADC, communication interfaces, 2.4-3.6 V operation
PDF  93 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

32F030F4P6 数据表(HTML) 88 Page - STMicroelectronics

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Package information
STM32F030x4/x6/x8/xC
88/93
DS9773 Rev 4
7.5
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 21: General operating conditions.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
TA max is the maximum ambient temperature in °C,
•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ ((VDD - VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
7.5.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Table 63. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJ
Thermal resistance junction-ambient
LQFP64 - 10 mm x 10 mm
44
°C/W
Thermal resistance junction-ambient
LQFP48 - 7 mm x 7 mm
55
Thermal resistance junction-ambient
LQFP32 - 7 mm x 7 mm
56
Thermal resistance junction-ambient
TSSOP20 - 6.5 mm x 6.4 mm
76



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