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GD5F1GQ4REFJS 数据表(PDF) 54 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD5F1GQ4REFJS 数据表(HTML) 54 Page - GigaDevice Semiconductor (Beijing) Inc. |
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54 / 60 page ![]() SPI(x1/x2/x4) NAND Flash 1G 54 21 PACKAGE INFORMATION Figure21-1. WSON8 (6*8mm) D E Top View D2 E2 L b e Bottom View c A1 A Side View Dimensions Symbol A A1 c b D D2 E E2 e L Unit mm Min 0.70 0.00 0.180 0.35 7.90 3.30 5.90 4.20 1.27 0.45 Nom 0.75 0.02 0.203 0.40 8.00 3.40 6.00 4.30 0.50 Max 0.80 0.05 0.250 0.45 8.10 3.50 6.05 4.40 0.55 Inch Min 0.028 0 0.007 0.014 0.311 0.130 0.232 0.165 0.05 0.018 Nom 0.030 0.001 0.008 0.016 0.315 0.134 0.236 0.169 0.020 Max 0.032 0.002 0.010 0.018 0.319 0.138 0.238 0.173 0.022 Note: 1. Both the package length and width do not include the mold flash. 2. The exposed metal pad area on the bottom of the package is floating. 3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm. 4. The lead shape may be of little difference according to different package lead frames. These lead shapes are compatible with each other. |
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