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GD25WD05C 数据表(PDF) 41 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25WD05C 数据表(HTML) 41 Page - GigaDevice Semiconductor (Beijing) Inc. |
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41 / 43 page ![]() Uniform Sector Standard and Dual Serial Flash GD25WD10C/05C 41 10.5. Package USON8 (3*2mm, 0.45mm thickness) D E Top View L E1 D1 L1 b Bottom View e A1 Side View c A 1 4 8 5 PIN 1# Dimensions Symbol A A1 c b D D1 E E1 e L L1 Unit mm Min 0.40 0.00 0.10 0.20 2.90 0.15 1.90 1.55 0.50 0.30 0.10 Nom 0.45 0.02 0.15 0.25 3.00 0.20 2.00 1.60 0.35 Max 0.50 0.05 0.20 0.30 3.10 0.25 2.10 1.65 0.40 Note: 1. Both the package length and width do not include the mold flash. 2. The exposed metal pad area on the bottom of the package is floating. 3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm. 4. The lead shape may be of little difference according to different package factories. These lead shapes are compatible with each other. |
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