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ADMV1014ACCZ-R7 数据表(PDF) 35 Page - Analog Devices |
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ADMV1014ACCZ-R7 数据表(HTML) 35 Page - Analog Devices |
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35 / 42 page ![]() Data Sheet ADMV1014 Rev. A | Page 35 of 42 RECOMMENDED LAND PATTERN Solder the exposed pad on the underside of the ADMV1014 to a low thermal and electrical impedance ground plane. This pad is typically soldered to an exposed opening in the solder mask on the evaluation board. Connect these ground vias to all other ground layers on the evaluation board to maximize heat dissipation from the device package. Figure 122. Evaluation Board Layout for the LGA package EVALUATION BOARD INFORMATION For more information about the ADMV1014 evaluation board, refer to the ADMV1014-EVALZ user guide. |
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