56F8167 datasheet(140/184 Pages) FREESCALE

140 / 184 page

56F8367 Technical Data, Rev. 7.0

140

Freescale Semiconductor

Preliminary

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-

mal test board.

2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC specification JESD51-2

in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes

(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name

for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.

3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured values using the cold

plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is

described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when

the package is being used with a heat sink.

4. Thermal Characterization Parameter, Psi-JT (

JT ), is the "resistance" from junction to reference point thermocouple on top cen-

ter of case as defined in JESD51-2.

JT is a useful value to use to estimate junction temperature in steady-state customer en-

vironments.

5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

6. See Part 12.1 for more details on thermal design considerations.

7. TJ = Junction temperature

TA = Ambient temperature

TBD = numbers will be available late Q4 2005

Table 10-2 56F8367/56F8167 ElectroStatic Discharge (ESD) Protection

Characteristic

Min

Typ

Max

Unit

ESD for Human Body Model (HBM)

2000

—

ESD for Machine Model (MM)

200

—

ESD for Charge Device Model (CDM)

500

—

Table 10-3 Thermal Characteristics6

Characteristic

Comments

Symbol

Value

Unit

Notes

160-pin LQFP

160MAPBGA

Junction to ambient

Natural convection

RθJA

38.5

39.90

°C/W

Junction to ambient (@1m/sec)

RθJMA

35.4

46.8

°C/W

Junction to ambient

Natural convection

Four layer board (2s2p)

RθJMA

(2s2p)

TBD

°C/W

1, 2

Junction to ambient (@1m/sec)

Four layer board (2s2p)

RθJMA

(2s2p)

31.5

TBD

°C/W

1, 2

Junction to case

RθJC

8.6

TBD

°C/W

Junction to center of case

0.8

TBD

°C/W

4, 5

I/O pin power dissipation

P I/O

User-determined

Power dissipation

P D

P D = (IDD x VDD + P I/O)W

Maximum allowed PD

PDMAX

(TJ - TA) / R

θJA7

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