F 2000D

2003-04-15

3

Mechanische Werte

Mechanical values

Bezeichnung

Parameter

Symbol

Symbol

Wert

Value

1)

Einheit

Unit

min.

typ.

max.

Chipkantenlänge (x-Richtung)

Length of chip edge (x-direction)

L

x

0.68

0.7

0.72

mm

Chipkantenlänge (y-Richtung)

Length of chip edge (y-direction)

L

y

0.68

0.7

0.72

mm

Durchmesser des Wafers

Diameter of the wafer

D

100

mm

Chiphöhe

Die height

H

200

220

240

µm

Bondpaddurchmesser

Diameter of bondpad

d

110

120

130

µm

Weitere Informationen

Additional information

2)

Vorderseitenmetallisierung

Metallization frontside

Aluminium

Aluminum

Rückseitenmetallisierung

Metallization backside

Goldlegierung

Gold alloy

Trennverfahren

Dicing

Sägen

Sawing

Verbindung Chip - Träger

Die bonding

Kleben

Epoxy bonding

1)

Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information.

This is not a specified value

2)

All chips are checked according to the following procedure and the OSRAM OS specification of the visual inspection

A63501-Q0013-N001-*-76G3:

The visual inspection shall be made in accordance to the "specification of the visual inspection" as referenced.The

visual inspection of chip backside is performed with stereo microscope with incident light with 40x-80x magnification.

Areas > ¼ cm² which have an amount of more than 3% failed dies will be removed. The visual inspection of chip

frontside is performed by a stereo microscope with incident light with 40x-80x magnification for 100% of the area of

each wafer. Areas > 1 cm² which have an amount of more than 50% failed dies and areas > 2 cm² which have an

amount of more than 25% failed dies will be removed. In areas with failure density higher than 1% each failure die is

inked individually. On request the visual inspection of chip frontside can be performed by an automated visual

inspection combined with automated inking additionally. The quality inspection (final visual inspection) is performed

by production. An additional visual inspection step as special release procedure by QM after the final visual inspection

is not installed.