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OPA202, OPA2202, OPA4202

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SBOS812E – OCTOBER 2017 – REVISED FEBRUARY 2020

Product Folder Links: OPA202 OPA2202 OPA4202

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Copyright © 2017–2020, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA202

OPA202

UNIT

D (SOIC)

DGK (VSSOP)

DBV (SOT-23)

8 PINS

8 PINS

5 PINS

Junction-to-ambient thermal resistance

136

176.7

206.0

°C/W

Junction-to-case (top) thermal resistance

74

63.9

121.8

°C/W

Junction-to-board thermal resistance

62

99.4

65.9

°C/W

Junction-to-top characterization parameter

19.7

8.8

39.0

°C/W

Junction-to-board characterization parameter

54.8

97.6

65.6

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2202

OPA2202

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

180.1

°C/W

Junction-to-case (top) thermal resistance

68.3

°C/W

Junction-to-board thermal resistance

101.4

°C/W

Junction-to-top characterization parameter

10.5

°C/W

Junction-to-board characterization parameter

99.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4202

OPA4202

UNIT

D (SOIC)

14 PINS

Junction-to-ambient thermal resistance

87.9

°C/W

Junction-to-case (top) thermal resistance

42.7

°C/W

Junction-to-board thermal resistance

44.6

°C/W

Junction-to-top characterization parameter

8.9

°C/W

Junction-to-board characterization parameter

44.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W