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LSM303C 数据表(PDF) 22 Page - STMicroelectronics

部件名 LSM303C
功能描述  Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer
PDF  53 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

LSM303C 数据表(HTML) 22 Page - STMicroelectronics

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Application hints
LSM303C
22/53
DocID024975 Rev 2
5
Application hints
Figure 8. LSM303C electrical connections
The device core is supplied through the Vdd line while the I/O pads are supplied through the
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 μF aluminum) should
be placed as near as possible to pin 9 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 8). It is possible to remove Vdd, maintaining Vdd_IO,
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data are selectable and
accessible through the I2C or SPI interfaces. When using the I2C, CS must be tied high (i.e.
connected to Vdd_IO).
The functions, the threshold and the timing of the two interrupt pins (INT_XL and INT_MAG)
can be completely programmed by the user through the I2C/SPI interface.
5.1
Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standards.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
Digital signal from/to signal controller. Signal levels are defined by proper selection of Vdd_IO.
Vdd_IO
C2=10µF
Vdd
C3=100nF
GND
SCL/SPC
SDA/SDI/SDO
CS_XL
CS_MAG
GND
Vdd_IO
4
1
6
5
INT_MAG
12
11
7
10
Vdd
C4=100nF
C1=100nF
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