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STSPIN220 数据表(PDF) 22 Page - STMicroelectronics |
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STSPIN220 数据表(HTML) 22 Page - STMicroelectronics |
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22 / 27 page ![]() Table 14. VFQFPN 3x3x1.0 16L package mechanical data Symbol Dimensions (mm) Min. Typ. Max. Notes A 0.80 0.90 1.00 (1) (2) A1 0.02 0.05 A3 0.20 b 0.18 0.25 0.30 D 2.9 3.00 3.1 D1 1.50 D2 1.70 1.80 1.90 E 2.9 3.00 3.1 E1 1.50 E2 1.70 1.80 1.90 e 0.45 0.50 0.55 L 0.30 0.40 0.50 ddd 0.08 1. VFQFPN stands for "thermally-enhanced very thin fine pitch quad package, no lead". Very thin: 0.80 < A ≤ 1.00 mm / Fine pitch: e < 1.00 mm. The pin 1 identifier must be present on the top surface of the package as an indentation mark or other feature of the package body. 2. The chamfer of lead n 1,4,5,8,9,12,13,16 is 0.042 mm in both, x and y direction, with 45°.s Figure 18. VFQFPN 3x3x1.0 16L recommended footprint STSPIN220 VFQFPN 3x3x1.0 16L package information DS11633 - Rev 4 page 22/27 |
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