2

Electrical data

2.1

Absolute maximum ratings

Symbol

Parameter

Test condition

Value

Unit

Supply voltage

-0.3 to 11

V

Logic input voltage

-0.3 to 5.5

V

Output-to-sense voltage drop

Up to 12

V

Supply-to-output voltage drop

Up to 12

V

Sense pin voltage

-1 to 1

V

Reference voltage input

-0.3 to 1

V

Continuous power stage output current (each bridge)

1.3

Operative junction temperature

-40 to 150

°C

Storage junction temperature

-55 to 150

°C

2.2

Recommended operating conditions

Symbol

Parameter

Test condition

Min

Typ

Max

Unit

Supply voltage

1.8

10

V

Logic input voltage

0

5

V

Reference voltage input

0.1

0.5

V

Logic inputs positive/negative pulse width

300

ns

2.3

Thermal data

Symbol

Parameter

Conditions

Value

Unit

Junction to ambient thermal

resistance

Natural convection, according to JESD51-2a (1)

57.1

°C/W

Junction to case thermal resistance

(top side)

Simulation with cold plate on package top

67.3

°C/W

Junction to case thermal resistance

(bottom side)

Simulation with cold plate on exposed pad

9.1

°C/W

Junction to board thermal resistance According to JESD51-8(1)

23.3

°C/W

Junction to top characterization

According to JESD51-2a(1)

3.3

°C/W

Junction to board characterization

According to JESD51-2a(1)

22.6

°C/W

1. Simulated on a 21.2x21.2 mm board, 2s2p 1 Oz copper and four 300 µm vias below exposed pad.

STSPIN220

DS11633 - Rev 4

page 3/27