7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input Voltage

BAT

–0.3

6

V

INT, PULS, CE

–0.3

6

V

SRP, SRN, BAT_SNS

–0.3

V

TS

–0.3

2.1

V

SCL, SDA/HDQ

–0.3

6

V

–40

85

°C

–40

125

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM) on all pins, per ANSI/ESDA/

JEDEC JS-001(1)

±1500

V

Charged-device model (CDM) on all pins, per JEDEC

specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM enables safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM enables safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

No operating restrictions

2.0

5.5

V

External capacitor from BAT to

VSS

1

µF

Temperature sense

0

1.8

V

Input and output pins

0

V

Communication pins

0

V

7.4 Thermal Information

Over-operating free-air temperature range (unless otherwise noted)

THERMAL METRIC(1)

BQ27Z561-R2

UNIT

DSBGA (YPH)

(12 PINS)

Junction-to-ambient thermal resistance

64.1

°C/W

Junction-to-case (top) thermal resistance

59.8

Junction-to-board thermal resistance

52.7

Junction-to-top characterization parameter

0.3

Junction-to-board characterization parameter

28.3

BQ27Z561-R2

SLUSE22 – SEPTEMBER 2020

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