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ADP7118ACPZN-R7 数据表(PDF) 20 Page - Analog Devices |
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ADP7118ACPZN-R7 数据表(HTML) 20 Page - Analog Devices |
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20 / 24 page  ADP7118 Data Sheet Rev. F | Page 20 of 24 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP7118. However, as listed in Table 6, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUT and GND pins. Use of 0805 or 1206 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. Figure 64. Example LFCSP PCB Layout Figure 65. Example SOIC PCB Layout |
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