ADA4355ABCZ datasheet(13/45 Pages) AD

13 / 45 page

Data Sheet

ADA4355

Rev. A | Page 13 of 45

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

VCC to GND

−0.3 V to +4.0 V

VEA, VED to GND

−0.3 V to +2.0 V

VLD to GND

−0.3 V to VCC

CLKP, CLKN, SPI1 to GND

−0.3 V to +2.0 V

INPUT to GND

−0.2 V to VCC + 0.2 V

Analog Input Current

40 mA

Control2 to GND

−0.3 V to VCC + 0.3 V or 1 mA,

whichever occurs first

Digital Output3 to GND

−0.3 V to +2.0 V

Environmental Temperature

Storage Range (Ambient)

−65°C to +125°C

Maximum Junction

125°C

Electrostatic Discharge (ESD)

Human Body Model

INPUT (Ball E1) and DNC

(Ball F1) Balls

500 V

All Other Balls

3000 V

Field Induced Charge

Device Model (FICDM)

1250 V

Assemble (Soldering, 10 sec)

300°C

Includes SCLK, SDIO, and CS.

Includes FSEL, GSEL1, GSEL0, and VLDEN.

Includes D0AP, D0AN, D1AP, D1AN, DCOP, DCON, FCOP, and FCON.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

Thermal resistance values specified in Table 7 are calculated

based on standard JEDEC specifications.

Table 7. Thermal Resistance

Package Type

θJA

θJCTOP

ΨJT

Unit

BC-84-4

52.6

22.0

17.7

°C/W

Only use θJA and θJCTOP to compare thermal performance of the

package of the device with other semiconductor packages when

all test conditions listed are similar. One common mistake is to

use θJA and θJC to estimate the junction temperature in the system

environment. Instead, using ΨJT is a more appropriate way to

estimate the worst case junction temperature of the device in the

system environment. First, take an accurate thermal measurement

of the top center of the device (on the mold compound in this

case) while the device operates in the system environment. This

measurement is known in the following equation as TTOP.

Then, use this equation to solve for the worst case TJ in that

given environment as follows:

TJ = ΨJT × P + TTOP

where:

ΨJT is the junction to top thermal characterization number as

specified in the data sheet.

P refers to the total power dissipation in the chip (W).

TTOP refers to the package top temperature (°C) and is measured

at the top center of the package in that given environment.

ESD CAUTION

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