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AS4LC2M8S1 数据表(PDF) 9 Page - Alliance Semiconductor Corporation

部件名 AS4LC2M8S1
功能描述  3.3V 2M x 8/1M x 16 CMOS synchronous DRAM
PDF  28 Pages
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制造商  ALSC [Alliance Semiconductor Corporation]
网页  https://www.alliancememory.com
标志 ALSC - Alliance Semiconductor Corporation

AS4LC2M8S1 数据表(HTML) 9 Page - Alliance Semiconductor Corporation

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AS4LC2M8S1
AS4LC1M16S1
7/5/00
ALLIANCE SEMICONDUCTOR
9
Notes
1IDD is dependent on output loading and cycle rates. Specified values are obtained with minimum cycle time and the outputs open.
2
Other input signals are allowed to transition no more than once in any two-clock period and are otherwise at valid V IH or VIL levels.
3
Address transitions average one transition every two-clock period.
4The IDD current will decrease as the CAS-latency is reduced. This is due to the fact that the maximum cycle rate is slower as the CAS-l atency is reduced.
5tCK = 7 ns for –7, 8 ns for –8, and 10 ns for –10.
6If clock tr > 1 ns, (tr/2 – 0.5)ns should be added to the parameter.
7If clock (tr and tf) > 1 ns, [(tr + tf)/2 – 1] ns should be added to the parameter.
8VIH overshoot: VIH(max) = VDDQ + 2V for a pulse width ≤ 3 ns, and the pulse width cannot be greater than one third of the cycle rate. V IL undershoot:
VIL(min) = –2V for a pulse width ≤ 3 ns and the pulse width cannot be greater than one third of the cycle rate.
9
Required clocks are specified by JEDEC functionalisty and are not dependent on any timing parameter.
10 The clock frequency must remain constant during access or precharge states (READ, WRITE, including tWR and PRECHARGE commands). CKE may be
used to reduce the data rate.
11 Timing actually specified tWR plus tRP; clock(s) specified as a reference only at minimum cycle rate.
12 Timing actually specified by tWR.
13 tHZ defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL. The last valid data element will meet tOH
before going to HIGH-Z.
14 CLK must be toggled a minimum of two times during this period.
15 Enables on-chip refresh and address counters.
16 All voltages referenced to VSS.
17 The minimum specifications are used only to indicate the cycle time at which proper operation over the full temperature range (0
° C ≤ T
A ≤ 70° C) is
endured.
tMRD
Load mode register to
active/refresh command
2–
2
2
tCK
5
tOH
Output data hold time @
30 pF
32
2.5
3
–ns
6
22
2.5
3
–ns
6
12
2.5
3
–ns
6
tPED
CKE to CLOCK enable or
power-down exit mode
1–
1
1
tCK
tRAS
Active to precharge
command
42
120,000
48
120,000
50
120,000
ns
tRC Active command period
70
80
80
ns
8
tRCAR Auto refresh period
70
80
80
ns
tRCD
Active to read or write
delay
20
24
30
ns
8
tREF
Refresh period—2048
rows
–64
64
64
ms
tROH
Data-out high Z from
precharge/burst stop
command
33
3
3
tCK
9
22
2
2
tCK
9
11
1
1
tCK
9
tRP
Precharge command
period
21
24
30
ns
8
tRRD
Active Bank A to Active
Bank B command
14
16
20
ns
tT
Transition time
0.3
1.0
0.3
1.0
0.3
1.0
ns
tWR WRITE recovery time
2
–2–
2
tCK
tXSR
Exit SELF REFRESH to
ACTIVE command
70
80
80
ns
20
Sym
Parameter
CAS
latency
–7
–8
–10
Unit
Notes
Min
Max
Min
Max
Min
Max



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