ADPA7009CHIP

Data Sheet

Rev. 0 | Page 28 of 28

OUTLINE DIMENSIONS

2.750

1.845

*This die utilizes fragile air bridges. Any pickup tools used must not contact this area.

TOP VIEW

(CIRCUIT SIDE)

SIDE VIEW

0.572

0.108

0.114

0.389

0.389

0.460

0.112

0.354

0.255

0.179

0.220

0.179

0.255

0.175

0.130

0.898

0.102

0.644

0.786

0.197

0.197

0.653

0.890

(Pads 2, 3, 5, 7, 9, 10)

0.240

0.130

0.119

0.118

0.093

0.012

0.898

(Pads 1 and 6)

(Pads 4 and 8)

*AIR BRIDGE

AREA

0.104

(Pads 2 - 5)

0.105

(Pads 7 - 10)

0.102

Figure 82. 10-Pad Bare Die [CHIP]

(C-10-13)

Dimensions shown in millimeter

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADPA7009CHIP

−55°C to +85°C

10-Pad Bare Die [CHIP]

C-10-13

ADPA7009C-KIT

−55°C to +85°C

10-Pad Bare Die [CHIP]

C-10-13

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D26020-3/21(0)