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ADPA7009CHIP 数据表(PDF) 18 Page - Analog Devices |
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ADPA7009CHIP 数据表(HTML) 18 Page - Analog Devices |
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18 / 28 page ![]() ADPA7009CHIP Data Sheet Rev. 0 | Page 18 of 28 THEORY OF OPERATION The architecture of the ADPA7009CHIP, a medium power amplifier, is shown in Figure 65. The ADPA7009CHIP uses a cascaded, four-stage amplifier operating in quadrature between two 90° hybrids. The input signal is divided evenly in two. Each path is amplified through four independent gain stages. The amplified signals are then combined at the output. This balanced amplifier approach forms an amplifier with a combined gain of 19.5 dB and a PSAT value of 29 dBm. The gate pins are internally connected and can be biased from either north or south of the circuit. A portion of the RF output signal is directionally coupled to a diode for detection of the RF output power. When the diode is dc biased, the diode rectifies the RF power and makes the RF power available for measurement as a dc voltage at VDET. To allow temperature compensation of VDET, an identical and symmetrically located circuit, minus the coupled RF power, is available via VREF. Taking the difference of VREF − VDET provides a temperature compensated signal that is proportional to the RF output (see Figure 65). VDD2 VDD4 RFOUT VREF DIRECTIONAL COUPLER VGG1 VGG2 VDD1 VDD3 RFIN VDET Figure 65. ADPA7009CHIP Architecture |
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