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ADPA7009CHIP 数据表(PDF) 1 Page - Analog Devices |
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ADPA7009CHIP 数据表(HTML) 1 Page - Analog Devices |
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1 / 28 page ![]() 20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier Data Sheet ADPA7009CHIP Rev. 0 Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibilityisassumedbyAnalogDevicesforitsuse,norforanyinfringementsofpatentsorother rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2021 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com FEATURES Output P1dB: 28.5 dBm typical at 24 GHz to 36 GHz PSAT: 29 dBm typical at 24 GHz to 36 GHz Gain: 19.5 dB typical at 24 GHz to 36 GHz Input return loss: 17.5 dB typical at 24 GHz to 36 GHz Output return loss: 22.0 dB typical at 24 GHz to 36 GHz Output IP3: 35 dBm typical at 24 GHz to 36 GHz Supply voltage: 5 V typical at 750 mA 50 Ω matched input and output Die size: 2.750 mm × 1.845 mm× 0.102 mm APPLICATIONS Military and space Test instrumentation Satellite communications FUNCTIONAL BLOCK DIAGRAM VREF 5 VDD2 4 VDD1 3 VGG1 2 RFIN 1 VGG2 10 VDD3 9 VDD4 8 VDET 7 RFOUT 6 ADPA7009CHIP Figure 1. GENERAL DESCRIPTION The ADPA7009CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 29 dBm saturated output power (0.5 W) distributed power amplifier that operates from 20 GHz to 54 GHz. The amplifier provides a gain of 19.5 dB, an output power for 1 dB compression (P1dB) of 28.5 dBm, and a typical output third-order intercept (IP3) of 35 dBm at 24 GHz to 36 GHz. The ADPA7009CHIP requires 750 mA from a 5 V supply voltage (VDD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the RFIN and RFOUT pads connected via one 0.076 mm (3 mil) ribbon bond of 0.076 mm (3 mil) minimal length. |
类似零件编号 - ADPA7009CHIP |
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类似说明 - ADPA7009CHIP |
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