ADRF6780ACPZN-R7 datasheet(24/35 Pages) AD

24 / 35 page

ADRF6780

Data Sheet

Rev. D | Page 24 of 35

WIDE FREQUENCY PERFORMANCE

Figure 73 and Figure 74 show the typical performance of the

ADRF6780 when using values outside of the RF output

frequency range. It is important to understand that this

performance is typical and not guaranteed.

Figure 73 was tested in I/Q mode with an RF output frequency

of 1 GHz to 31 GHz. The LO input frequency was switched to

LO ×2 doubler mode above 14 GHz.

Figure 74 was tested in IF mode with an RF output frequency of

1 GHz to 31 GHz. The LO input frequency was switched to LO

×2 doubler mode above 14 GHz.

–65

–55

–45

–35

–25

–15

–5

RF FREQUENCY (GHz)

MAIN TONE

SIDEBAND

LO FEEDTHROUGH

Figure 73. Output Power (POUT) vs. RF Frequency (fRF) in I/Q Mode at

the Maximum Gain Setting, BB I/Q Amplitude = −15 dBm

–65

–55

–45

–35

–25

–15

–5

RF FREQUENCY (GHz)

MAIN TONE

SIDEBAND

LO FEEDTHROUGH

Figure 74. Output Power (POUT) vs. RF Frequency (fRF) in IF Mode at

the Maximum Gain Setting, IF Amplitude = −12 dBm

LO Path ×1, ×2 Full Range

Figure 75 shows the typical performance of the ADRF6780

when the LO input frequency is used within the full frequency

range. It is important to understand that this performance is

typical and not guaranteed.

Figure 75 was tested with the LO path set to ×1 mode and ×2 mode

with a 5.9 GHz to 23.6 GHz frequency range in I/Q mode. It is

recommended to switch to LO ×2 doubler mode above 14 GHz to

achieve better performance out of the device.

–65

–55

–45

–35

–25

–15

–5

RF FREQUENCY (GHz)

MAIN TONE (LO ×1)

MAIN TONE (LO ×2)

SIDEBAND (LO ×1)

SIDEBAND (LO ×2)

LO FEEDTHROUGH (LO ×1)

LO FEEDTHROUGH (LO ×2)

Figure 75. LO ×1 Mode and LO ×2 Mode, Output Power (POUT) vs.

RF Frequency (fRF) in I/Q Mode at the Maximum Gain Setting,

BB I/Q Amplitude = −15 dBm

LAYOUT

Solder the exposed pad on the underside of the ADRF6780 to a

low thermal and electrical impedance ground plane. This pad is

typically soldered to an exposed opening in the solder mask on

the evaluation board. Connect these ground vias to all other

ground layers on the evaluation board to maximize heat

dissipation from the device package.

Figure 76. Evaluation Board Layout for the ADRF6780 Package

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