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MCP3564 数据表(PDF) 33 Page - Microchip Technology |
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MCP3564 数据表(HTML) 33 Page - Microchip Technology |
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33 / 108 page ![]() 2019-2021 Microchip Technology Inc. DS20006181C-page 33 MCP3561/2/4 5.1.1 BURNOUT CURRENT SOURCES FOR SENSOR OPEN/SHORT DETECTION The ADC inputs, VIN-/VIN+, feature a selectable burn- out current source, which enables open or short-circuit detection, as well as biasing very low-current external sensors. The bias current is sourced on the VIN+ pin of the ADC (noninverting output of the analog multiplexer) and sunk on the VIN- pin of the ADC (inverting output of the analog multiplexer). Since the same current flows at the VIN-/VIN+ pins of the ADC, it can sense the impedance of an externally connected sensor that would be connected between the selected inputs of the multiplexer. When the sensor is in short circuit, the ADC converts signals that are close to 0V. When the sensor is an open circuit, the ADC converts signals that are close to the AVDD voltage. The current source is an independent peripheral of the ADC. It does not need the ADC to be in Conversion mode to be present. Once enabled, the source pro- vides current even when the ADC is in Reset or ADC Shutdown mode. The current source can be configured at any time through programming the CS_SEL[1:0] bits in the CONFIG0 register (see Table 5-2). Since the amount of current selected can be very small, it may be necessary to diminish the MCLK master clock frequency to be able to reach the full desired accuracy during conversions (the settling time of the input structure, including the sensor, can be large if the sensor is very resistive, which will limit the bandwidth of the Sample-and-Hold input circuit). The accuracy of the current sources is on the order of magnitude of ±20% and not very well controlled internally. However, the mismatch between sink and source is typically around ±1%. This relatively low accuracy on the current is generally sufficient for open/short detection applications. Figure 2-35 shows how the ADC output code varies when the burnout current sources are enabled (with Gain = 1x) and the input sensor impedance is swept with a large dynamic range. This allows the use of the ADC as an open/short-detection circuit, which is practical when manufacturing complex remote sensor systems. 5.1.2 INTERNAL TEMPERATURE SENSOR The device includes an on-board temperature sensor, which is made of two typical P-N junction diodes biased by fixed current sources (TEMP Diode P and M). The TEMP Diode P has a current density of 4x of the TEMP Diode M. The difference in the current densities of the diodes yields a voltage that is a function of the absolute temperature. Once the ADC inputs (VIN-/VIN+) are connected to the temperature sensor diodes (MUX[7:0] = 0xDE), the ADC will see a VIN differential input that is the function of the temperature. The transfer function of the temperature sensor can be approximated by a linear equation or a third-order equation for more accuracy. When the internal temperature sensor is selected for the MUX or SCAN input, the input sink/source current source, controlled by the CS_SEL[1:0] bits (see Section 5.1 “Analog Input Multiplexer”), is disabled internally (even though the CS_SEL[1:0] bits are not modified by the temperature sensor selection). In this case, the input current source is replaced by a specific internal current source that will only be sourced to the diode temperature sensor (see Figure 5-1). The bias current of the diodes is not calibrated internally and can lead to a relatively large gain and offset error in the transfer function of the temperature sensor. Typical graphs showing the typical error in the temperature measurement are provided in Section 2.0 “Typical Performance Curves” (see Figure 2-32 for first-order and Figure 2-33 for third-order fitting). The accuracy can also be optimized by using proper digital gain and offset error calibration schemes. TABLE 5-2: BURNOUT CURRENT SOURCE SETTINGS CS_SEL[1:0] (Source/Sink) Burnout Current Amplitude 00 0µA 01 0.9 µA 10 3.7 µA 11 15 µA |
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