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MCP3564 数据表(PDF) 98 Page - Microchip Technology |
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MCP3564 数据表(HTML) 98 Page - Microchip Technology |
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98 / 108 page  MCP3561/2/4 DS20006181C-page 98 2019-2021 Microchip Technology Inc. RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 1.80 1.80 MILLIMETERS 0.40 BSC MIN E MAX 3.00 Contact Pad Length (X20) Contact Pad Width (X20) Y1 X1 0.80 0.20 Microchip Technology Drawing C04-2264A NOM SILK SCREEN 1 2 20 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 3.00 Contact Pad to Center Pad (X20) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 20-Lead Ultra Thin Plastic Quad Flat, No Lead Package - 3x3 mm Body [UQFN] (Formerly Q3DE; SST Legacy Package) |
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