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ADPA1107ACPZN-R7 数据表(PDF) 5 Page - Analog Devices

部件名 ADPA1107ACPZN-R7
功能描述  45.0 dBm (35 W), 4.8 GHz to 6.0 GHz, GaN Power Amplifier
PDF  20 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADPA1107ACPZN-R7 数据表(HTML) 5 Page - Analog Devices

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Data Sheet
ADPA1107
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Drain Bias Voltage (VDD1A, VDD1B, VDD2A, and VDD2B)
35 V dc
Negative Gate Bias Voltage (VGG1), VDD = 28 V
(Nominal Drain Voltage)
−8 V dc to
−1 V dc
RF Input Power (RFIN)
31 dBm
Drain and Gate Bias
Pulse Width
1000 µs
Duty Cycle
40%
Maximum Pulsed Power Dissipation (PDISS)
Drain Bias Pulse Width = 100 µs and
TBASE = 85°C
At 10% Duty Cycle, Derate 581 mW/°C
Above 85°C
81.4 W
At 40% Duty Cycle, Derate 538 mW/°C
Above 85°C
75.2 W
Drain Bias Pulse Width = 1000 µs and
TBASE = 85°C
At 10% Duty Cycle, Derate 459 mW/°C
Above 85°C
64.2 W
Temperature
Nominal Pulsed Peak Channel, TBASE = 85°C,
PIN = 27 dBm
Drain Bias Pulse Width = 100 µs
PDISS = 27.9 W at 5.4 GHz, and at
10% Duty Cycle
133°C
PDISS = 29.2 W at 5.4 GHz and at
40% Duty Cycle
139.3°C
Drain Bias Pulse Width = 1000 µs
PDISS = 28.3 W at 5.4 GHz and at
10% Duty Cycle
146.7°C
Maximum Channel
225°C
Maximum Peak Reflow for Moisture Sensitivity
Level (MSL) 31
260°C
Storage Range
−60°C to +125°C
Operating Range
−40°C to +85°C
1
See the Ordering Guide section.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Overall thermal performance is directly linked to printed circuit
board (PCB) design and operating environment. Careful
attention to PCB thermal design is required.
θJC is the channel to case thermal resistance (channel to exposed
metal on the underside of the device).
Table 4. Thermal Resistance
Package Type1
θJC
Unit
CP-40-7
Drain Bias Pulse Width = 100 µs at 10% Duty Cycle
1.72 °C/W
Drain Bias Pulse Width = 100 µs at 40% Duty Cycle
1.86 °C/W
Drain Bias PulseWidth = 1000 µs at 10% Duty Cycle
2.18 °C/W
1
θJC was determined under the following conditions: the heat transfer is due
solely to the thermal conduction from the channel through the ground pad
to the PCB, and the ground pad is held constant at the operating
temperature of 85°C.
ELECTROSTATIC DISCHARGE (ESD) RATINGS
The following ESD information is provided for handling of
ESD-sensitive devices in an ESD protected area only.
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
ESD Ratings for ADPA1107
Table 5. ADPA1107, 40-Lead LFCSP
ESD Model
Withstand Threshold (V)
Class
HBM
500
1B
ESD CAUTION



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