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ADPA1107ACPZN-R7 数据表(PDF) 5 Page - Analog Devices |
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ADPA1107ACPZN-R7 数据表(HTML) 5 Page - Analog Devices |
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5 / 20 page ![]() Data Sheet ADPA1107 Rev. 0 | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Drain Bias Voltage (VDD1A, VDD1B, VDD2A, and VDD2B) 35 V dc Negative Gate Bias Voltage (VGG1), VDD = 28 V (Nominal Drain Voltage) −8 V dc to −1 V dc RF Input Power (RFIN) 31 dBm Drain and Gate Bias Pulse Width 1000 µs Duty Cycle 40% Maximum Pulsed Power Dissipation (PDISS) Drain Bias Pulse Width = 100 µs and TBASE = 85°C At 10% Duty Cycle, Derate 581 mW/°C Above 85°C 81.4 W At 40% Duty Cycle, Derate 538 mW/°C Above 85°C 75.2 W Drain Bias Pulse Width = 1000 µs and TBASE = 85°C At 10% Duty Cycle, Derate 459 mW/°C Above 85°C 64.2 W Temperature Nominal Pulsed Peak Channel, TBASE = 85°C, PIN = 27 dBm Drain Bias Pulse Width = 100 µs PDISS = 27.9 W at 5.4 GHz, and at 10% Duty Cycle 133°C PDISS = 29.2 W at 5.4 GHz and at 40% Duty Cycle 139.3°C Drain Bias Pulse Width = 1000 µs PDISS = 28.3 W at 5.4 GHz and at 10% Duty Cycle 146.7°C Maximum Channel 225°C Maximum Peak Reflow for Moisture Sensitivity Level (MSL) 31 260°C Storage Range −60°C to +125°C Operating Range −40°C to +85°C 1 See the Ordering Guide section. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Overall thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the channel to case thermal resistance (channel to exposed metal on the underside of the device). Table 4. Thermal Resistance Package Type1 θJC Unit CP-40-7 Drain Bias Pulse Width = 100 µs at 10% Duty Cycle 1.72 °C/W Drain Bias Pulse Width = 100 µs at 40% Duty Cycle 1.86 °C/W Drain Bias PulseWidth = 1000 µs at 10% Duty Cycle 2.18 °C/W 1 θJC was determined under the following conditions: the heat transfer is due solely to the thermal conduction from the channel through the ground pad to the PCB, and the ground pad is held constant at the operating temperature of 85°C. ELECTROSTATIC DISCHARGE (ESD) RATINGS The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only. Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. ESD Ratings for ADPA1107 Table 5. ADPA1107, 40-Lead LFCSP ESD Model Withstand Threshold (V) Class HBM 500 1B ESD CAUTION |
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