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ADPA7005CHIP 数据表(PDF) 5 Page - Analog Devices |
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ADPA7005CHIP 数据表(HTML) 5 Page - Analog Devices |
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5 / 23 page ![]() Data Sheet ADPA7005CHIP Rev. 0 | Page 5 of 23 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 2. Pin Configuration Table 6. Pin Function Descriptions Pin No. Mnemonic Description 1 RFIN RF Signal Input. This pad is ac-coupled and matched to 50 Ω. 2, 12 VGG1, VGG2 Amplifier Gate Control. External bypass capacitors of 4.7 μF, 0.01 μF, and 100 pF are required. ESD protection diodes are included and turn on below −1.5 V. 3, 4, 5, 9, 10, 11 VDD5, VDD3, VDD1, VDD2, VDD4, VDD6 Drain Bias for the amplifier. External bypass capacitors of 4.7 μF, 0.01 μF, and 100 pF are required. 6 VREF Reference Diode. Use this pin in combination with VDET. The voltage provides temperature compensation to the VDET RF output power measurements. 7 RFOUT RF Signal Output. This pad is ac-coupled and matched to 50 Ω. 8 VDET Detector Diode Used for Measuring the RF Output Power. Detection via this pin requires the application of a dc bias voltage through an external series resistor. Used in combination with VREF, the difference voltage, VREF − VDET, is a temperature compensated dc voltage proportional to the RF output power. Die Bottom GND Ground. The pads and die bottom must be connected to RF and dc ground. VGG1 VDD5 VDD1 VREF RFIN RFOUT VDET VDD2 VDD4 VDD6 VGG2 9 1 7 10 11 12 VDD3 2 3 5 6 8 4 ADPA7005 TOP VIEW (Not to Scale) |
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